3D Image Sensing / Sensors – R&D Positions

Image Sensor R&D Positions – Leuven

Our client is currently expanding their 3D Image Sensor division, and are looking for experienced engineers / researchers in various individual skillsets for their teams in Leuven.

Responsibilities of the team:

– Overall R&D of new 3D Image Sensor Technology 

– Optimization of 3D Image sensor chip according to chip system specification

–  Conduct relevant technical research with the team, including process development and optimization, chip architecture design.

–  Expand and manage local image sensing technology collaboration

– Chip & Circuit Design and Architecture for 3D Image sensor

Requirements:

• M.Sc. or above (Ph.D. preferred)

• Minimum 3+ Years’ proffesional work experience, in relevant R&D area

• Experience  with – 3D Image Sensors, 3D Imaging,  3DIC design, Time-of-Flight, Semiconductor Fab, 3D Imaging Product ramp-up, 3D Integration, CMOS Sensors etc.

There are various skillsets required and positions available at varying levels of seniority – all permanent contracts.

For full details, to arrange an application or to answer any questions, I can also be contacted at sp@eu-recruit.com

By applying to this role you understand that we may collect your personal data and store and process it on our systems. For more information please see our Privacy Notice https://eu-recruit.com/about-us/privacy-notice/

Keywords://  3D image sensor, imaging, CMOS, semiconductor, ToF, IC, integration, 3DIC, research, leuven