3D Integration Engineer

3D Integration Engineer – IC design & Manufacturing – European Recruitment, Leuven, Flanders, Belgium

Thank you for your interest in this incredible opportunity.

The Company:

One of the world leaders in IC Chip Design, Wireless technologies and Mobile telecommunications. You will be focusing on Mobile Camera technologies within one of the world’s largest Smartphone manufacturers.

You will-

• Contribute to the definition of 3D integrated system technology roadmap, definition of the design, sign-off and testing methodologies

• Manage technology demonstrator projects and support the transfer of new technologies from R&D to production.  

Needed:

• Sc. or Ph.D. in Electrical Engineering or related discipline with a minimum of 5 years industrial experience
• In-depth knowledge of semiconductor process technology, preferably including advanced 3D integration technologies such as WLCSP, D2W and W2W bonding, hybrid bonding, TSV and TDV
• Knowledgeable about integrated circuit architecture and design flows; previous experience as IC designer or architect is desirable
• Knowledgeable about system-level issues such as power and clock distribution, thermal budgeting, signal and power integrity
• Knowledgeable about DFT and ATPG

Nice to have:

• Experience with technology CAD (TCAD) is a plus
• Experience designing and characterizing test chips is desirable

If you would be interested in this 3D Integration Engineer opportunity, please send your CV through to tc@eu-recruit.com. I look forward to speaking with you in more detail and helping you take that next step in your career.

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