Process Engineer (Team Leader)

Website European Recruitment

We are working with one of the world’s leading Semiconductor and Telecommunications companies who are currently building a new team in Germany, focused on the development of highly advanced micro electronic package designs.


This is a Team Leader role, so previous experience in managing other engineers/technicians/operators is necessary, as well as a background in semiconductor process engineering and production. 


Other Requirements include: 

  • Relevant Scientific degree
  • Strong communication skills
  • Background and experience in Semiconductor packaging technologies (molding, flip-chip, die attach etc)
  • Additional training/certifications (Project Management, Six Sigma, Quality Control etc) are a bonus
  • German language skills (B2 or higher) is a plus 


If you are interested in this Process Engineering role, apply today with an up to date CV or email me at for more details.


Keywords: Semiconductors / Semiconductor Jobs / Process Engineering / Team Leadership / Semiconductor Packaging / 


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Categories: Semiconductor & Electronics

  Salary: Negotiable

  Location: Munich Area, Germany

  Job type: Permanent, Full Time