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Packaging Engineer

Recruitment Consultant
Chris Canneaux
Posted
19 days ago

Package Design Engineer

We are actively seeking a Package Design Engineer, based at any of our global office locations.

Responsibilities

  • Complete all package-design activities within the timelines defined by project deliverables
  • Execute package-design review processes with assembly partners to ensure compliance with design rules
  • Collaborate closely with IC layout engineers throughout the package-design phase
  • Verify electrical characteristics of package and unit designs using industry-standard software tools
  • Ensure cost-effective methodologies are incorporated into BGA substrate and lead-frame designs (e.g., multilayer structures, mechanical drill requirements, plating considerations)
  • Provide support, guidance, and instructions for all assembly and packaging-related activities, questions, and issues
  • Present weekly activity and progress reports to cross-functional teams
  • Work with cross-functional groups—including product design, engineering, and marketing—to ensure packaging requirements are fully supported by manufacturing and assembly partners

Required Experience

  • Minimum 5 years of experience in IC package design using relevant EDA tools
  • Hands-on experience with package-design and extraction tools (e.g., Cadence APD/SIP, Virtuoso, extraction tools, power-analysis tools, Ansys SiWave/Q3D, or equivalent)
  • Experience using CAD tools such as AutoCAD
  • Knowledge of electronic IC packaging technologies is essential
  • Basic understanding of thermal and mechanical behaviour of IC packages
  • Beneficial: foundational understanding of IC physical layout

Required Skills

  • Proven top-level package-design and RLC-extraction capability
  • Ability to perform package-parasitics extraction
  • Strong task-management and planning skills, including accurate estimation of design timelines
  • Ability to work within tight and shifting schedules
  • Strong interpersonal and communication abilities
  • Effective networking, negotiation, and influencing skills
  • Comfortable managing communication with external assembly partners

 

Industry
Semiconductor
Contract Type
Permanent
Location
Switzerland
City
Lausanne
Work Model
On-Site

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