Vice President of Engineering (Mixed-Signal ICs)

Vice President of Engineering (Mixed-Signal ICs)

Location: Flexible / Aachen-based preferred | Full-time

About the Role
We are seeking an experienced and visionary Vice President of Engineering to lead and scale our IC design and 
development teams. This executive position is ideal for a technically sharp and strategically minded leader with a 
strong background in digital, analog, and mixed-signal IC design, coupled with proven success in bringing silicon 
products to mass production. In this role, you will work in close cooperation with our CTO to shape the 
engineering roadmap, drive innovation, and guide the team through all stages of development—from 
architecture to tape-out and product launch.

Key Responsibilities
• Define and own the engineering strategy and execution roadmap for our mixed-signal products.
• Lead multidisciplinary teams across analog, digital, and mixed-signal domains (including architecture, 
design, layout, and verification).
• Oversee the end-to-end IC product development lifecycle, including design, validation, tape-out, test, and 
production.
• Drive technical decision-making in complex tradeoffs between performance, power, area, and cost.
• Establish and maintain scalable engineering processes and best practices.
• Collaborate closely with product management, operations, and customer teams to ensure successful delivery and deployment.
• Represent engineering in front of customers, strategic partners, and executive stakeholders.

Qualifications
• 15+ years of engineering experience in the semiconductor industry, with at least 5 years in executive or senior leadership roles.
• Deep technical expertise in analog and digital circuit design, including strong mixed-signal IC experience.
• Proven success in leading teams through multiple silicon tape-outs and volume production cycles.
• Hands-on familiarity with EDA tools and methodologies across the IC design flow (Cadence, Synopsys, etc.).
• Strong understanding of system-level integration, test methodologies, and post-silicon validation.
• Track record of building, scaling, and retaining high-performing, geographically distributed engineering teams.
• Experience in defining and managing budgets, timelines, and engineering metrics.
• Excellent leadership, communication, and stakeholder management skills.
• MSc or PhD in Electrical Engineering, Microelectronics, or a related field.

What We Offer
• An opportunity to lead cutting-edge innovation in mixed-signal ICs for next-generation communications and sensor technologies.
• A high-impact leadership role in a fast-paced and mission-driven team.
• Competitive compensation package including equity (VESOP).
• International, inclusive team culture with room for creativity and ownership