Senior R&D Semiconductor Packaging Engineer

Senior R&D Semiconductor Packaging Engineer

European Recruitment are working closely with a leading electronics company, based in Lampertheim, that are looking for an experienced Senior R&D Semiconductor Packaging Engineer to join their team.

In this role you will be a key member of the core discrete and IC packaging R&D team. Your main responsibility in this position will be the design, research, and prototyping for a wide range of silicon and wide-band-gap device technologies.

Responsibilities as Senior R&D Semiconductor Packaging Engineer:

• Discrete & IC device packaging design including co-development with subcontract assembly and tooling suppliers using state-of-the-art CAD tools in support of new product development manufacturing transfer programs
• Periodic validation and review of design and project goals as part of the New Product Development Process
• Collaborate with the Supply Chain Team on vendor selection, qualification, and specification development
• Plan and execute test characterization, and qualification to optimize the assembly process and establish device manufacturing manufacturability and reliability
• Establish and maintain design rules for Power semiconductor discrete packaging
• Conduct and approve device packaging proposals, design, process flows, technical specifications, reliability requirements, data collection and analysis
• Document and maintain design documentation including device and component drawings, bonding diagrams etc. using Autodesk AutoCAD
• Interface closely with assembly sites both internal and external
• Lead new materials selection and development including molding compounds, die attach adhesives/solders and interconnect materials
• Interconnect technology development including new wire bonding materials/techniques, wafer/die bumping, Cu clip, etc.
• Protect IP through disclosures, patent applications, defensive publications and similar activities

Requirements:

• Bachelor’s or master’s degree in Engineering (Electrical, Mechanical or Microelectronic preferred)
• 5 years of experience in semiconductor packaging & assembly technology
• Proficiency in using ME 3D CAD tools for design, leadframe design and FEA for analysis. (Autodesk and ANSYS preferred)
• Ability to work with multi-functional and multi-cultural teams
• You’re open-minded, have an innovation mindset and are accustomed to work on tight deadlines and handling multiple priorities

If this role is of any interest please apply directly on LinkedIn or send a copy of your CV to nh@eu-recruit.com.

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