3D Image Sensing / Sensors – R&D Positions

Website European Recruitment

Image Sensor R&D Positions – Leuven

 

Our client is currently expanding their 3D Image Sensor division, and are looking for experienced engineers / researchers in various individual skillsets for their teams in Leuven.

 

 

Responsibilities of the team:

 

– Overall R&D of new 3D Image Sensor Technology 

 

– Optimization of 3D Image sensor chip according to chip system specification

 

–  Conduct relevant technical research with the team, including process development and optimization, chip architecture design.

 

–  Expand and manage local image sensing technology collaboration

 

– Chip & Circuit Design and Architecture for 3D Image sensor

 

 

Requirements:

 

  • M.Sc. or above (Ph.D. preferred)

 

  • Minimum 3+ Years’ proffesional work experience, in relevant R&D area

 

  • Experience  with – 3D Image Sensors, 3D Imaging,  3DIC design, Time-of-Flight, Semiconductor Fab, 3D Imaging Product ramp-up, 3D Integration, CMOS Sensors etc.

 

 

There are various skillsets required and positions available at varying levels of seniority – all permanent contracts.

 

For full details, to arrange an application or to answer any questions, I can also be contacted at sp@eu-recruit.com


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Keywords://  3D image sensor, imaging, CMOS, semiconductor, ToF, IC, integration, 3DIC, research, leuven 

Categories: Computer Vision , Semiconductor & Electronics

  Salary: Negotiable

  Location: Leuven, Belgium

  Job type: Permanent, Full Time