Website European Recruitment
Image Sensor R&D Positions – Leuven
Our client is currently expanding their 3D Image Sensor division, and are looking for experienced engineers / researchers in various individual skillsets for their teams in Leuven.
Responsibilities of the team:
– Overall R&D of new 3D Image Sensor Technology
– Optimization of 3D Image sensor chip according to chip system specification
– Conduct relevant technical research with the team, including process development and optimization, chip architecture design.
– Expand and manage local image sensing technology collaboration
– Chip & Circuit Design and Architecture for 3D Image sensor
There are various skillsets required and positions available at varying levels of seniority – all permanent contracts.
For full details, to arrange an application or to answer any questions, I can also be contacted at firstname.lastname@example.org
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Keywords:// 3D image sensor, imaging, CMOS, semiconductor, ToF, IC, integration, 3DIC, research, leuven
Categories: Computer Vision , Semiconductor & Electronics