R&D Manager – Semiconductor Packaging – Discrete and IC Devices

R&D Manager – Semiconductor Packaging – Power Discrete and IC Devices

I am working with a global electronics manufacturer who produce billions of components including semiconductors, sensors, switches and fuses.

They are looking for a R&D Manager – Power Discrete Packaging to join the core discrete and IC packaging R&D team in Lampertheim, just outside of Mannheim and less than an hour from Frankfurt.

The role will focus on driving the development of innovative, high-performance power discrete packaging, and leading a team of two direct reports.

Key Roles and Responsibilities:

• Discrete & IC device packaging design – using CAD tools
• Effectively lead and develop the team
• Validation and review of design and project goals
• Plan and execute test characterization, and qualification to optimize assembly process
• Establish and maintain design rules for Power semiconductor discrete packaging
• Document and maintain design documentation using Autodesk AutoCAD

Key Skills and Experiences Required:

• Degree in Engineering
• 7+ years of experience in semiconductor packaging & assembly technology
• Strong leadership or management experience
• Good English and German language skills (minimum B2)
• ME 3D CAD tools for design, leadframe design and FEA for analysis (Autodesk and ANSYS preferred)

Keywords: Manager / Semiconductor / Packaging / Power Discrete / IC / Integrated Circuit / Assembly

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