Senior R&D Engineer – Semiconductor Packaging – Discrete and IC Devices

Senior R&D Engineer – Semiconductor Packaging – Discrete and IC Devices

European Recruitment

Senior R&D Engineer – Semiconductor Packaging – Discrete and IC Devices

Here at European Recruitment, we are teamed with a global electronics manufacturer who produce billions of components including semiconductors, sensors, switches and fuses.

They are looking for a Senior R&D Engineer – Packaging to join the core discrete and IC packaging R&D team in Lampertheim, just outside of Mannheim, and less than an hour from Frankfurt.

The role will focus on designing, researching, and prototyping for a wide range of silicon and wide-band-gap device technologies.

Key Roles and Responsibilities:

  • Discrete & IC device packaging design – using CAD tools
  • Validation and review of design and project goals
  • Plan and execute test characterization, and qualification to optimize assembly process
  • Establish and maintain design rules for Power semiconductor discrete packaging
  • Document and maintain design documentation using Autodesk AutoCAD

Key Skills and Experiences Required:

  • Degree in Engineering
  • 5+ years of experience in semiconductor packaging & assembly technology
  • Good English and German language skills (minimum B2)
  • ME 3D CAD tools for design, leadframe design and FEA for analysis (Autodesk and ANSYS preferred)

Keywords: Semiconductor / Packaging / Power Discrete / IC / Integrated Circuit / Assembly

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