Senior R&D Semiconductor Packaging Engineer
European Recruitment are working closely with a leading electronics company, based in Lampertheim, that are looking for an experienced Senior R&D Semiconductor Packaging Engineer to join their team.
In this role you will be a key member of the core discrete and IC packaging R&D team. Your main responsibility in this position will be the design, research, and prototyping for a wide range of silicon and wide-band-gap device technologies.
Responsibilities as Senior R&D Semiconductor Packaging Engineer:
- Discrete & IC device packaging design including co-development with subcontract assembly and tooling suppliers using state-of-the-art CAD tools in support of new product development manufacturing transfer programs
- Periodic validation and review of design and project goals as part of the New Product Development Process
- Collaborate with the Supply Chain Team on vendor selection, qualification, and specification development
- Plan and execute test characterization, and qualification to optimize the assembly process and establish device manufacturing manufacturability and reliability
- Establish and maintain design rules for Power semiconductor discrete packaging
- Conduct and approve device packaging proposals, design, process flows, technical specifications, reliability requirements, data collection and analysis
- Document and maintain design documentation including device and component drawings, bonding diagrams etc. using Autodesk AutoCAD
- Interface closely with assembly sites both internal and external
- Lead new materials selection and development including molding compounds, die attach adhesives/solders and interconnect materials
- Interconnect technology development including new wire bonding materials/techniques, wafer/die bumping, Cu clip, etc.
- Protect IP through disclosures, patent applications, defensive publications and similar activities
Requirements:
- Bachelor’s or master’s degree in Engineering (Electrical, Mechanical or Microelectronic preferred)
- 5 years of experience in semiconductor packaging & assembly technology
- Proficiency in using ME 3D CAD tools for design, leadframe design and FEA for analysis. (Autodesk and ANSYS preferred)
- Ability to work with multi-functional and multi-cultural teams
- You’re open-minded, have an innovation mindset and are accustomed to work on tight deadlines and handling multiple priorities
If this role is of any interest please apply directly on LinkedIn or send a copy of your CV to nh@eu-recruit.com.
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