Director – Power Packaging

You will be joining a world-leading technology company at their manufacturing technology centre in Weilheim (greater Munich).

Responsibilities

• Lead the Power Packaging team, consisting of top experts, in researching and developing cutting-edge semiconductor packaging technologies.
• Oversee the development of advanced packaging technologies for power semiconductors, ensuring innovation and alignment with industry needs.
• Define the long-term roadmap and business plan for advanced packaging technology. Conduct internal requirements assessments, market analysis, trend analysis, and supply-chain ecosystem evaluations to inform strategy.
• Identify and explore business opportunities within different business groups. Seek out potential partners and customers for power packaging technologies to drive business growth.
• Optimize the R&D process for power semiconductor packaging. Manage maturity levels, project milestones, and release checklists to ensure high quality, with a particular focus on meeting automotive requirements.

Requirements

• Master’s or PhD in Engineering, Power Electronics, or a related field.
• Over 10 years of experience with leading semiconductor companies, particularly in backend assembly and electronic package development for power applications. At least 5 years of disciplinary management or team-leading experience in R&D.
• Deep understanding of power electronics, semiconductor industry, and electronic package assembly.
• Excellent communication, presentation, negotiation, and documentation skills in English. Proficiency in one additional language (German or Chinese) is required.
• Ability to work effectively in a multi-cultural and multi-geographical engineering environment. Demonstrated experience in handling changes and uncertainties within a diverse team.
• Open to international business trips or delegations.

 
Benefits

• Annual Bonus
• Relocation Package
• Lunch Vouchers
• Equipment (laptop, etc.)