Board Level Multi-Physical System Engineer

Recruitment Consultant

Simon Troupe

Contact Details

[email protected] +44 (0)330 335 2369

Posted

18 days ago

Responsibilities

Investigate emerging technologies such as electromagnetic, thermo-mechanical, and physicochemical field simulation modeling of complex modules, particularly at their interfaces (e.g., BLT/TIM or underfill) using in-situ non-destructive techniques.
Offer technical expertise on upcoming technology trends and apply them to hardware products.
Work collaboratively with local teams to tackle forthcoming challenges and contribute to the preparation of specifications and design documents.

Key Requirements

In-depth knowledge of microelectronics packaging, module substrate processes, and module processes, with the ability to independently perform multi-physical field and multi-scale simulation and modeling of complex module packaging
Proficiency in multi-scale and multi-physical field simulation modeling in areas such as electricity, magnetism, heat transfer, and mechanics. Familiar with packaging reliability challenges, including warpage and stress management, thermo-migration, electro-migration, and heat dissipation
Strong understanding of material properties of constitutive layers like PCB, TIM, substrate, and underfill, and their impact on overall integration
Experience with industrial simulation software such as COMSOL or HFSS; Python coding experience is a plus
Ability to work both independently and in a team, with strong communication skills and adaptability to diverse team environments
Eligibility to work in the European Union
Fluency in English is required

Industry

Semiconductor

Contract Type

Permanent

Location

France

Work Model

On-Site

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