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At European Recruitment, our sectors cover a wide range of industries within the field of technology
At European Recruitment, our sectors cover a wide
range of industries within the field of technology
At European Recruitment, our sectors cover a wide
range of industries within the field of technology
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At European Recruitment, our sectors cover a wide range of industries within the field of technology
Board Level Multi-Physical System Engineer
Responsibilities
- Investigate emerging technologies such as electromagnetic, thermo-mechanical, and physicochemical field simulation modeling of complex modules, particularly at their interfaces (e.g., BLT/TIM or underfill) using in-situ non-destructive techniques.
- Offer technical expertise on upcoming technology trends and apply them to hardware products.
- Work collaboratively with local teams to tackle forthcoming challenges and contribute to the preparation of specifications and design documents.
Key Requirements
- In-depth knowledge of microelectronics packaging, module substrate processes, and module processes, with the ability to independently perform multi-physical field and multi-scale simulation and modeling of complex module packaging
- Proficiency in multi-scale and multi-physical field simulation modeling in areas such as electricity, magnetism, heat transfer, and mechanics. Familiar with packaging reliability challenges, including warpage and stress management, thermo-migration, electro-migration, and heat dissipation
- Strong understanding of material properties of constitutive layers like PCB, TIM, substrate, and underfill, and their impact on overall integration
- Experience with industrial simulation software such as COMSOL or HFSS; Python coding experience is a plus
- Ability to work both independently and in a team, with strong communication skills and adaptability to diverse team environments
- Eligibility to work in the European Union
- Fluency in English is required
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