3D Integration Program Director – R&D

3D Integration Program Director – R&D

A global tech giant, investing heavily into R&D across Europe is expanding it’s teams, so a great time to join!

Responsibilities

• Lead high-impact projects in AI/CPU, networking, and other future-driven areas!
• Design and implement a competitive 3D engineering architecture based on cutting-edge application scenarios.
• Decompose complex engineering structures into actionable plans and take charge of risk management to turn technical ideas into commercial breakthroughs.
• Drive innovative research and engage in global knowledge exchange with industry leaders on 3D technologies.
• Bring your expertise in 3D integration (think 3D IC, 3D packaging, chip-to-chip technologies) to shape the future of telecommunications, AI, and 5G.

Essential Requirements

• PhD in Engineering, Materials Science, or a related field
• Over 10 years of experience in 3D integration, semiconductor manufacturing, or advanced materials
• Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.
• Strong communication skills and a collaborative mindset – work with brilliant minds across multiple teams.
• Excellent analytical abilities and experience in leading complex projects.