R&D Engineer Of Board / Module High-Current PDN

A leading global technology company headquartered in China is seeking a highly skilled R&D Engineer of Board/Module High-Current PDN to join their team. This company is renowned for its innovative solutions in information and communications technology (ICT) infrastructure and devices, serving customers in over 170 countries and regions.

Responsibilities

• Explore board-level high-current PDN technologies and conduct electromigration, through-current modeling and simulation, and performance evaluation of interconnection microstructures such as the board power plane, BGA ball, and via.

• Research innovative technologies for low-loss and high-current power supply architecture, take charge of the electromigration and through-current capability improvement of 1000 A+ high-current PDNs, and resolve the through-current bottleneck and key technical challenges of boards and modules.
• Undertake board-level PDN technology development projects with low loss and large current, and support the competitiveness of large current and energy efficiency of the next-generation large-sized CPU.
• Build the capability of simulating and testing the electromigration of PDN microstructures (vias, bumps, and balls) under low voltage and high current.

Requirements

• Master’s degree or above in Electrical Engineering, Computer Engineering, or Computer Science; PhD preferred.

• Successful experience in developing power supply systems such as large chips and CPUs, with a deep understanding of board-level power supply architecture, board-level PDN design, power encapsulation, and power conversion modules.
• Experience in developing simulation and testing of high-current electromigration and through-current capability.
• Knowledge of PCB microstructure (vias and BGA balls), PCB surface treatment methods, and BGA solder materials.
• Excellent communication and presentation skills.