Team Lead – Photolithography

Recruitment Consultant

Simon Troupe

Contact Details

[email protected] +44 (0)330 335 2369

Posted

2 hours ago

Team Lead – Photolithography

Job Summary:
We are seeking a Process Engineering Cell Lead to join the Fab Engineering and Technical Operations teams. In this role, you will optimize existing processes for R&D and wafer manufacturing, develop new processes to meet future device requirements, and support process transfers to large-volume production. You will work in clean room and lab areas, collaborating closely with facility engineers, equipment engineers, and integration teams.

Key Responsibilities:

Leadership:

Lead the Photolithography Team, providing guidance and mentorship to engineers and technicians.
Set clear goals and performance reviews for team members to meet customer requirements.
Manage project timelines, ownership, and cell-related deliverables.
Foster a culture of continuous improvement and safety awareness.
Work with supply chain partners to develop technologies aligned with business goals.

Technical Competency:

Lead the process development roadmap, ensuring processes and tools stay at the forefront of technology.
Drive creativity within the team to address challenges and maintain technological leadership.
Oversee daily operations of process toolsets, managing R&D and manufacturing wafers.
Improve processes to enhance productivity, reduce scrap, and improve quality.
Apply statistical methods (SPC, FMEA, Gage R&R) to improve manufacturability and reproducibility.
Document procedures and write SOPs for process operations.
Perform additional tasks as required by the Process Engineering Manager.

Person Specification:

Required:

Minimum 5 years of experience in Process Engineering or Process Development.
Hands-on experience in photolithography processing and process equipment.
Expertise in structured problem-solving techniques.
Master’s degree in Physics, Chemistry, Material Science, Chemical Engineering, or Electronics Engineering.
Experience with SPC processes.

Desired:

Leadership and project management experience.
Familiarity with E-Beam Lithography and wet etching processing.
Knowledge of InP materials and processing.
Proficiency in SPC, Six Sigma, and Gauge R&R studies (Green Belt certification a plus).
Experience in design of experiments (DOE) and statistical analysis.

Personal Attributes:

Ability to work under pressure to meet deadlines with a calm demeanor.
Proactive team player with the ability to work independently.
Strong attention to detail and a collaborative, positive attitude.
Excellent communication and interpersonal skills.
Supportive of company culture and ethos.

Industry

Semiconductor

Contract Type

Permanent

Location

United Kingdom

Work Model

On-Site

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