Thermal and Mechanical Modeling & Simulation Engineer

Join our innovative team as a Thermal and Mechanical Modeling & Simulation Engineer where your expertise will be pivotal in shaping the future of integrated circuit technology. You’ll play a critical role in understanding the complex physical behavior of our cutting-edge 3DIC designs, ensuring their performance, reliability, and longevity under diverse conditions. This is a chance to apply your deep analytical skills to solve real-world challenges and directly influence product success.

Responsibilities

• Pioneer next-generation designs: Conduct sophisticated thermal and stress modeling and simulation for 3DICs, delving into critical areas like heat conduction, material expansion, mechanical stress, and intricate multi-physics couplings (thermo-mechanical, electro-thermal, electromagnetic, and beyond).
• Optimize and innovate: Leverage advanced numerical simulation methods to not only analyze thermal and stress behavior but also to proactively optimize designs and resolve potential thermal management challenges before they arise.
• Drive tool evolution: Utilize commercial simulation tools to validate performance and reliability, while also taking the lead in optimizing and iterating on our in-house simulation capabilities. You’ll refine numerical equations to enhance accuracy and efficiency.
• Collaborate and influence: Work seamlessly with cross-functional teams, providing essential technical support in thermal and stress modeling to ensure our design solutions are implemented successfully.
• Advance methodologies: Continuously improve modeling methodologies and simulation workflows, directly enhancing the overall efficiency of our research and development efforts.

Essential Requirements

• 5-10+ years of hands-on experience in a relevant modeling and simulation capacity.
• A robust foundation in mathematics, physics, and thermodynamics, with a particular emphasis on heat conduction, stress analysis, and materials science.
• Proven familiarity with thermal and stress modeling methods and strong proficiency in numerical simulation techniques (e.g., finite element analysis).
• Expert-level command of simulation tools such as ANSYS, COMSOL, Cadence, or similar industry-standard software.
• Direct experience in semiconductor 3DIC design, including a deep understanding of, and ability to address, thermal stress issues in semiconductor packaging and multilayer structures.
• Proficiency in programming languages like Python and C++, enabling you to independently develop scripts for custom analysis.
• Prior work experience in semiconductor packaging, 3DIC design, or closely related fields is highly valued.

Educational Requirements

• Master’s degree or higher in Electrical Engineering, Physics, Mechanical Engineering, or a related quantitative field (Ph.D. preferred).