Senior Thermal Research Engineer

Senior Thermal Design Expert

Employment Type: Full-Time

About the Role

We are seeking a highly experienced and forward-thinking Senior Thermal Design Expert to lead the development of next-generation thermal solutions for high-power, high heat flux AI chips. This role is pivotal in shaping advanced cooling strategies that ensure reliability, performance, and scalability in state-of-the-art computing systems.

Key Responsibilities

• Lead the design and innovation of thermal management architectures for AI processors and high-performance SoCs with extreme power densities.

• Collaborate closely with system, packaging, and mechanical design teams to optimize thermal paths from chip to system level.

• Evaluate and integrate emerging cooling technologies, including novel thermal interface materials (TIMs), advanced heat sinks, vapor chambers, and liquid cooling systems.

• Stay at the forefront of industry and academic research in thermal design, packaging, and chip-scale cooling.

• Develop and maintain strategic collaborations with universities and research institutions; represent the company in academic and industrial consortia.

Qualifications

• Ph.D. or Master’s degree in Mechanical Engineering, Thermal Engineering, Electronics, or a related field.

• 8+ years of experience in thermal design for high-performance computing, AI chips, or high-power electronics.

• Deep expertise in thermal modeling, materials characterization, and cooling system design.

• Proven familiarity with cutting-edge thermal materials and next-generation cooling technologies.

• Demonstrated success in collaborative research and innovation, ideally with established academic partnerships.

Preferred Skills

• Experience with thermal simulation tools (e.g., ANSYS Icepak, FloTHERM, COMSOL).

• Knowledge of package-level and system-level integration constraints.

• Strong publication or patent record in thermal management or electronic cooling technologies.