Principal SI/PI Design Engineer

Principal SI/PI Design Engineer

Position Overview

A global communications and networking technology company is seeking a Principal Signal Integrity / Power Integrity (SI/PI) Design Engineer to lead advanced package design and electrical integration for next-generation high-speed semiconductor and photonic products.

This role focuses on package architecture, signal integrity, power integrity, RF performance, and advanced packaging technologies supporting high-bandwidth optical and communication systems. The successful candidate will work across silicon, packaging, photonics, and manufacturing teams to deliver highly optimized package solutions for complex mixed-signal products.

Key Responsibilities

Advanced Package Architecture

• Lead package selection and architecture decisions for next-generation semiconductor products.
• Define:
  • Package structures
  • BGA configurations
  • System-in-package (SiP) solutions
• Evaluate feasibility, performance, manufacturability, and cost trade-offs.

Package Design & Implementation

• Own package and substrate design activities from concept through tape-out.
• Drive:
  • Package layout
  • Design optimization
  • Verification and sign-off
• Ensure package solutions meet electrical, thermal, and manufacturing requirements.

Signal Integrity & Power Integrity Engineering

• Perform simulation and optimization of:
  • Signal integrity (SI)
  • Power integrity (PI)
  • RF performance
• Analyze high-speed interfaces and power delivery networks.
• Identify and resolve performance bottlenecks related to package and substrate design.

Cross-Functional Technical Leadership

• Collaborate with:
  • Silicon design teams
  • Photonics engineers
  • RF engineers
  • Manufacturing partners
  • External suppliers and contract manufacturers
• Optimize:
  • Silicon floorplans
  • Bump maps
  • Package pin assignments
• Balance performance, manufacturability, and system-level requirements.

Supplier & Manufacturing Engagement

• Work with packaging vendors and manufacturing partners on:
  • Existing product support
  • New package development
  • Design-for-manufacturing reviews
• Ensure successful transition from design to production.

Required Qualifications

• Bachelor’s degree in Electrical Engineering, Physics, or a related discipline.
• Minimum 5 years of hands-on experience in IC package design.
• Strong understanding of:
  • Signal integrity
  • Power integrity
  • High-speed electrical design principles
• Experience leading package development activities from concept through production.

Preferred Qualifications

Package & Substrate Design

• Experience designing substrates for:
  • RF devices
  • High-speed digital systems
  • Mixed-signal products
• Familiarity with advanced packaging technologies including:
  • 2.5D integration
  • 3D packaging
  • Interposer-based architectures

EDA & Simulation Tools

• Experience with package design tools such as:
  • Cadence Advanced Package Designer (APD)
  • Xpedition Package Designer (XPD)
• Expertise with SI/PI and electromagnetic simulation tools including:
  • HFSS
  • SIWave
  • Similar industry-standard platforms

Validation & Manufacturing

• Experience conducting:
  • Electrical design reviews
  • SI/PI analysis reviews
  • Design-for-manufacturing assessments
• Familiarity with package qualification and manufacturing processes.

Personal Attributes

• Strong engineering fundamentals and analytical thinking.
• Ability to solve complex multidisciplinary technical problems.
• Effective collaborator across silicon, packaging, and manufacturing teams.
• Strong ownership of technical decisions and delivery outcomes.
• Detail-oriented with a focus on product performance and reliability.