Senior RF/High-Speed Packaging Engineer

Recruitment Consultant

Jet Dela Cruz

Contact Details

jet@eu-recruit.com +44 (0)330 052 2459

Posted

1 day ago

You will be joining a world-leading technology company at their manufacturing technology centre in Weilheim (greater Munich).

You will be involved in the development of high-performance packaging architectures for next-generation telecommunications and high-speed data systems. You will be at the forefront of bridging cutting-edge research with commercial viability, ensuring our hardware meets the rigorous signal integrity and thermal demands of 5G-A, 6G, and electro-optical applications.

Responsibilities

Architectural Strategy: Lead the definition and maturation of RF/high-speed packaging solutions, focusing on performance optimization for passive/active devices and electro-optical co-packaging.
Technical Interface: Serve as the core bridge between research teams and business units, translating complex feasibility requirements into optimized, high-speed package designs.
Lifecycle Ownership: Manage the complete development process from initial conceptualization to manufacturing handoff, ensuring a holistic balance of thermal, mechanical, and electrical constraints.
Innovation & Gap Analysis: Scout the technological landscape for emerging packaging trends and implement innovative strategies to overcome current hardware limitations.
Strategic Partnerships: Cultivate relationships with European research hubs and suppliers to facilitate the rapid adoption and commercial scaling of new packaging technologies.
Technical Support & Troubleshooting: Partner with global cross-functional teams to troubleshoot production-level issues and support the rollout of new product applications.

Qualifications

Master’s or PhD in Electrical Engineering, Physics, Telecommunications, or an equivalent technical field.
5+ years in RF/high-speed device packaging, with a clear understanding of production methodologies.
Proficiency in circuit design software (e.g., Keysight ADS, Cadence/AWR) and 3D electromagnetic simulators (e.g., Ansys HFSS, CST Studio Suite).
Strong grasp of packaging materials and unit-level fabrication processes.
Proactive, team-oriented mindset suitable for a multidisciplinary and multicultural global environment.
Excellent presentation and technical communication skills in English; proficiency in German or Chinese is considered a significant asset.

Benefits

Annual Bonus
Relocation Package
Equipment (laptop, etc.)

Industry

Semiconductor

Contract Type

Permanent

Location

Germany

City

Weilheim

Work Model

On-Site

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