Front-end Wafer Process Engineer

Recruitment Consultant

Jet Dela Cruz

Contact Details

jet@eu-recruit.com +44 (0)330 052 2459

Posted

1 day ago

You will be joining a world-leading technology company at their manufacturing technology centre in Weilheim (greater Munich).

We are seeking an experienced semiconductor specialist to spearhead the optimization and establishment of frontend wafer-level fabrication processes. In this position, you will drive the development of innovative manufacturing methodologies, bridge the gap between process variables and final device behavior, and lead cross-functional technical teams to scale next-generation component platforms.

Responsibilities

Process Engineering & Innovation: Establish custom fabrication conditions to achieve exact device metrics while investigating novel manufacturing solutions using advanced technological concepts.
Specification & Parameter Control: Identify, monitor, and govern critical process parameters to set clear manufacturing baselines and link physical fabrication steps directly to final component characteristics.
Project & Integration Leadership: Direct multidisciplinary projects to refine process integration, establish best-known methods (BKM), and align technical outputs with target device tolerances.
“More-than-Moore” R&D: Scout, introduce, and integrate bleeding-edge technology roadmaps and specialized process modules to support novel production lines.
External & Academic Partnerships: Collaborate closely with external research organizations and equipment manufacturers to introduce, test, and optimize state-of-the-art wafer-level procedures.

Qualifications

Master’s degree or PhD in Physics, Chemistry, Electrical Engineering, Microsystems Technology, Semiconductor Science, or an equivalent technical field.
5+ years infront-end semiconductor module processing, with a preference for backgrounds in MEMS, photonics, or optical component manufacturing fabs.
Comprehensive command of semiconductor physics and microfabrication engineering.
Deep practical knowledge of specific module loops, including dry/wet etching, laser direct writing, chemical vapor deposition (PECVD), and wet bench operations.
Demonstrated capability to utilize data processing tools and evaluation frameworks to interpret parametric wafer testing, in-line metrics, and monitoring structures.
Proven skill in driving improvements across production yield, cost efficiency, process stability, and device reliability.
Exceptional communication and presentation capabilities in English; fluency in Chinese or German is considered an advantageous bonus.
A proactive, adaptable mindset with demonstrated leadership qualities and a readiness to operate effectively in a diverse, international workspace.
Flexibility to undertake occasional international travel to support joint technical ventures.

Benefits

Annual Bonus
Relocation Package
Equipment (laptop, etc.)

Industry

Semiconductor

Contract Type

Permanent

Location

Germany

City

Greater Munich

Work Model

On-Site

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Front-end Wafer Process Engineer

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